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 The next generation of off-line solder paste inspection systems and features cost effective solutions with the greatest accuracy. Measuring the average value of the solder paste, the largest and the smallest value, overall average value, area, volume, accuracy etc which is the most important measuring items.
Features - Measuring the average value of the solder paste, the largest and the smallest value, overall average value, area, volume, accuracy etc which is the most important measuring items.
- Authentic measuring based on the real 3D image.
- Precision is 1μ, fulfill process requirements.
- User friendly and easy operating.
- Powerful SPC function, suitable for checking the CSP and the fine pitch QFP paste locations.
- Suitable for lead and lead-free process.
- The optimal solution for monitoring and analysis of solder paste printing process
- The well designed graphical user interface makes the measuring operation easy and comfortable.
- Simple measuring process.
Measuring Principle - The machine scanning capability backed by precise laser sheet beam and scanning stage brings user 2D and 3D dimensional shape of a feature.
- Using precise function working table with FOV 6.4x4.8mm. Provide user sufficient information on printing process status and also suggests guideline how to stabilize the poor and hunting printing process.
- Specially designed for SMD in high precision and accuracy measurement. Fully automatic inspection can reduce human errors and provide hight measuring quality.
Measurement:
- Provide high precise accuracy for lead and lead-free printing and on different PCB color and materials
- 10μ m spatial resolutin. 1μ m height resolution and 1μ m height repeatability high resolution sensor and the accurate moving table guarantee reliable measuring of pastes on the very tiny pads such as 0201 CHIP PAD/CSP PAD/QFD PAD
User interface: - Provide user an easy understanding and familiar interface with powerful SPC which provides instant value and printing results.
- User friendly operation and report enable the user to gather information they needed in monitoring the printing process and measuring the solder paste including areas, height, volume, 3D image and cross section profiles of a pad can be display on the graph.
Specification: Working Table Dimension:
| 520(W)x400(D)mm | | Working Table Stroke: | 315mm (X Axis)
| | Motorized Stage Stroke: | 20mm (Y Axis)
| Measurable Depth:
| 500μm
| Senor Translation (Z Axis):
| 35mm
| | Spatial Resolution: | 10μm
| Height Resolution:
| 1μm | Height Accuracy (Note 1):
| ±1μm | Height Repeatability (Note 1):
| ±1μm | Measuring Speed:
| 30 Profiles/sec
| | Field of View (FOV)/Scanning Area: | 6.4 x 4.8mm | Measuring Principle:
| Optical Triangulation (Sheet Laser)
| | Measuring Mode: | Manual, Automatic
| Measurable Data:
| Area, Height, Volume
| 3D Viewer:
| 3D Open GL
| Quality Management:
| SPC included
| | Main Body Dimensions: | 656 (W) x 376(D) x 369(H)mm
| Electrical Requirement:
| AC100=240V. 50/60Hz
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