The purpose of a solderability test is to evaluate the solder coating on the termination leads for SMD and Through-Holded HF products. The enviro Automatic Solder Dipper batch-dip devices at an adjustable immersion speed into a solder pot, and then emerges to ambient at a separately adjustable speed, and the repeats the operation. The immersion, emersion speed and dwell time are all adjustable as well as its dipping cycle. An operator load devices onto a holding fixture and then snaps the fixture position. The holding fixture can be customized according to DUT (see sample holding fixtures picture on your right). For multiple-cycle dipping to IL-STD-883 (which specified rate of immersion, emersion and dwell), you can preset the number of dip cycles and the immersion depth.

 SPECIFICATION:

FEATURES:

•  Automated solder dipper with controller
•  Individual timing for immersion, emersion and dwell time
•  Accurately gauge solderability of terminations
•  Stainless Steel body and solder pots
•  RoHS leadfree compliant design